N-channel enhancement mode power MOSFET featuring 600V drain-source voltage and 1A continuous drain current. This single-element transistor is housed in a 3-pin DPAK (TO-252) surface-mount package with gull-wing leads. Key specifications include a maximum gate-source voltage of ±30V, a maximum drain-source on-resistance of 10000 mOhm at 10V, and a typical gate charge of 6.1 nC. The plastic package measures 6.7mm x 5.7mm x 2.5mm, supporting a maximum power dissipation of 39000 mW.
PackageDPAK
MountingSurface Mount
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Technical Specifications
Taiwan Semiconductor TSM1NB60CP ROG technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | TO-252 |
| Package/Case | DPAK |
| Package Description | Deca Watt Package |
| Lead Shape | Gull-wing |
| Pin Count | 3 |
| PCB | 2 |
| Tab | Tab |
| Package Length (mm) | 6.7(Max) |
| Package Width (mm) | 5.7(Max) |
| Package Height (mm) | 2.5(Max) |
| Seated Plane Height (mm) | 2.7(Max) |
| Pin Pitch (mm) | 2.3 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Configuration | Single |
| Category | Power MOSFET |
| Channel Mode | Enhancement |
| Channel Type | N |
| Number of Elements per Chip | 1 |
| Maximum Drain Source Voltage | 600V |
| Maximum Gate Source Voltage | ±30V |
| Maximum Continuous Drain Current | 1A |
| Maximum Gate Threshold Voltage | 4.5V |
| Maximum Drain Source Resistance | 10000@10VmOhm |
| Typical Gate Charge @ Vgs | 6.1@10VnC |
| Typical Gate Charge @ 10V | 6.1nC |
| Typical Input Capacitance @ Vds | 138@25VpF |
| Maximum Power Dissipation | 39000mW |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 150°C |
Compliance
| Cage Code | SDM41 |
| EU RoHS | Yes |
| HTS Code | 8541290095 |
| Schedule B | 8541290080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Taiwan Semiconductor TSM1NB60CP ROG Datasheet
Download the complete datasheet for Taiwan Semiconductor TSM1NB60CP ROG to view detailed technical specifications.
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