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Technical Specifications
TDK B57237-S509-M technical specifications.
General
| Contact Plating | Tin |
| Current Rating | 5A |
| Depth | 7mm |
| Diameter | 15mm |
| Dissipation Factor | 17% |
| Lead Diameter | 0.8mm |
| Lead Free | Lead Free |
| Lead Pitch | 7.5mm |
| Max Operating Temperature | 170°C |
| Min Operating Temperature | -55°C |
| Mount | Through Hole |
| Package Quantity | 500 |
| Packaging | Bulk |
| Radiation Hardening | No |
| Rated Temperature | 25°C |
| Resistance | 5R |
| Resistance Tolerance | 20% |
| RoHS Compliant | Yes |
| Series | 0 |
| Tolerance | 20% |
| Weight | 0.070548oz |
| Width | 7mm |
Compliance
| RoHS | Compliant |
Datasheet
TDK B57237-S509-M Datasheet
Download the complete datasheet for TDK B57237-S509-M to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.