High-speed fine-pitch connector featuring 266 positions with a 2.54mm/0.64mm pitch. This board-to-board connector supports data rates up to 10Gbps with differential signaling capabilities. It offers a 12.57mm stack height and a 21.6mm mated stacking height, with vertical orientation for both PCB mounting and overall connector. Constructed with a copper alloy contact material and gold/tin/lead plating, it operates within a -55°C to 125°C temperature range and has a contact current rating of 11.5A. The black housing is UL94 V-0 flammability rated.
MountingSurface Mount
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Technical Specifications
TE Connectivity 1-767005-4 technical specifications.
General
| Boss | No (Without) |
| Color | Black |
| Connector System | Board-to-Board |
| Contact Current Rating | 11.5A |
| Contact Material | Copper Alloy |
| Contact Plating | Gold, Tin, Lead |
| Data Rate | 10Gbps |
| Differential Signaling | Yes |
| ELV | Compliant |
| Flammability Rating | UL94 V-0 |
| Height | 0.49inch |
| Housing Color | Black |
| Lead Free | Contains Lead |
| Length | 101.6mm |
| Mated Stacking Heights | 21.6mm |
| Mating Alignment | Yes (With) |
| Mating Retention | No (Without) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Mount | Surface Mount |
| Number of Columns | 133 |
| Number of Contacts | 266 |
| Number of Positions | 266 |
| Number of Power Positions | 7 |
| Number of Rows | 2 |
| Number of Signal Positions | 266 |
| Orientation | Vertical |
| Package Quantity | 5 |
| Packaging | Rail/Tube |
| PCB Mount Alignment | Yes (With) |
| PCB Mount Retention | Without |
| PCB Mounting Orientation | Vertical |
| Pitch | 0.025inch |
| Radiation Hardening | No |
| RoHS Compliant | No |
| Series | MICTOR |
| Stack Height | 12.57mm |
| Stackable | Yes |
| Termination | SMD/SMT |
| Underplate Material | Nickel |
| Width | 5.2832mm |
Compliance
| RoHS | Not CompliantNo |
Datasheet
TE Connectivity 1-767005-4 Datasheet
Download the complete datasheet for TE Connectivity 1-767005-4 to view detailed technical specifications.
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