PackageCSP
Capacitance13.5pF
MountingSurface Mount
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Technical Specifications
TE Connectivity SESD0201C-120-058 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
BGA
Package/Case
CSP
Package Description
Chip Scale Package
Lead Shape
No Lead
Pin Count
2
PCB
2
Package Length (mm)
0.6
Package Width (mm)
0.3
Package Height (mm)
0.27
Package Material
Plastic
Mounting
Surface Mount
Configuration
Single
Type
TVS
Direction Type
Bi-Directional
Maximum Working Voltage
5V
Maximum Power Dissipation
250mW
Maximum Leakage Current
1uA
Capacitance
13.5pF
Number of Elements per Chip
1
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
SRP33
EU RoHS
Yes
HTS Code
8536308000
Schedule B
8536300000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
TE Connectivity SESD0201C-120-058 Datasheet
Download the complete datasheet for TE Connectivity SESD0201C-120-058 to view detailed technical specifications.
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