Frequency300MHz
PackageLFBGA
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Technical Specifications
Texas Instruments AM3356BZCZA30 technical specifications.
General
Package/Case
LFBGA
Contact Plating
Copper, Tin, Silver
Core Architecture
ARM
Data Bus Width
32b
Frequency
300MHz
Interface
I2C, SPI, USB, CAN, Ethernet, UART
Lead Free
Lead Free
Max Frequency
300MHz
Max Operating Temperature
105°C
Memory Type
ROM, RAM, L2 Cache
Min Operating Temperature
-40°C
Number of Cores
1
Number of UART Channels
6
Operating Supply Voltage
1.1V
Package Quantity
126
Packaging
Tray
RAM Size
64KB
RoHS Compliant
Yes
Series
Sitara™
Weight
0.060453oz
Compliance
RoHS
Compliant
Datasheet
Texas Instruments AM3356BZCZA30 Datasheet
Download the complete datasheet for Texas Instruments AM3356BZCZA30 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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