PackageSOP
MountingSurface Mount
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Technical Specifications
Texas Instruments AMC1200BDUBR technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOP
Package Description
Plastic Small Outline Package
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
9.55(Max)
Package Width (mm)
6.67(Max)
Package Height (mm)
3.35(Max)
Seated Plane Height (mm)
4.85(Max)
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-001BA
Type
Isolation Amplifier
Number of Elements per Chip
1
Number of Channels per Chip
1
Minimum PSRR
61(Typ)dB
Output Type
Differential
Maximum Input Offset Voltage
0.2(Typ)@[email protected]mV
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments AMC1200BDUBR Datasheet
Download the complete datasheet for Texas Instruments AMC1200BDUBR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.