Positive-edge triggered, non-inverting D-type bus interface flip-flop with 3-state outputs. This single-element CMOS logic IC features 8 inputs and 8 outputs, housed in a 20-pin SOIC (Small Outline IC) surface-mount package with gull-wing leads. The plastic package has a pin pitch of 1.27mm and dimensions up to 13mm (L) x 7.6mm (W) x 2.35mm (H), suitable for MS-013AC JEDEC standard. Operating temperature range is -55°C to 125°C.
PackageSOIC
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Texas Instruments CD74AC574M96 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
13(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.35(Max)
Seated Plane Height (mm)
2.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-013AC
Logic Family
AC
Logic Function
D-Type Bus Interface
Process Technology
CMOS
Number of Elements per Chip
1
Number of Element Inputs
8
Number of Element Outputs
8
Output Type
3-State
Polarity
Non-Inverting
Triggering Type
Positive-Edge
Min Operating Temperature
-55°C
Max Operating Temperature
125°C
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments CD74AC574M96 Datasheet
Download the complete datasheet for Texas Instruments CD74AC574M96 to view detailed technical specifications.
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