The CD74HC374MG4 is a 20-pin SOIC lead-frame SMT flip-flop from Texas Instruments. It features a small outline IC package with gull-wing leads and a seated plane height of 2.65mm. The device is designed for surface mount applications and is compliant with the MS-013AC Jedec standard. The flip-flop operates over a temperature range of -40°C to 125°C.
PackageSOIC
MountingSurface Mount
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Technical Specifications
Texas Instruments CD74HC374MG4 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 13(Max) |
| Package Width (mm) | 7.6(Max) |
| Package Height (mm) | 2.35(Max) |
| Seated Plane Height (mm) | 2.65(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-013AC |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments CD74HC374MG4 Datasheet
Download the complete datasheet for Texas Instruments CD74HC374MG4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.