PackageDSBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments CDC3S04YFFR technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | DSBGA |
| Package Description | Die Size Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 1.99(Max) |
| Package Width (mm) | 1.59(Max) |
| Package Height (mm) | 0.33(Max) |
| Seated Plane Height (mm) | 0.63(Max) |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | Fanout Buffer |
| Number of Outputs per Chip | 4 |
| Maximum Input Frequency | 52MHz |
| Min Operating Supply Voltage | 1.65V |
| Max Operating Supply Voltage | 1.95V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments CDC3S04YFFR Datasheet
Download the complete datasheet for Texas Instruments CDC3S04YFFR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.