PackageFBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments CLC5903CISM/NOPB technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 128 |
| PCB | 128 |
| Package Length (mm) | 11 |
| Package Width (mm) | 11 |
| Package Height (mm) | 0.94(Max) |
| Seated Plane Height (mm) | 1.4(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Function | Satellite |
| Minimum Frequency | 52MHz |
| Maximum Frequency | 78MHz |
| Min Operating Supply Voltage | 1.7V |
| Typical Operating Supply Voltage | 1.8V |
| Max Operating Supply Voltage | 1.9V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Maximum Supply Current | 0.02mA |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8541600025 |
| ECCN | 5A991.b |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments CLC5903CISM/NOPB Datasheet
Download the complete datasheet for Texas Instruments CLC5903CISM/NOPB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.