PackageFBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments CLC5903CISM/NOPB technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
128
PCB
128
Package Length (mm)
11
Package Width (mm)
11
Package Height (mm)
0.94(Max)
Seated Plane Height (mm)
1.4(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Function
Satellite
Minimum Frequency
52MHz
Maximum Frequency
78MHz
Min Operating Supply Voltage
1.7V
Typical Operating Supply Voltage
1.8V
Max Operating Supply Voltage
1.9V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Maximum Supply Current
0.02mA
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8541600025
ECCN
5A991.b
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments CLC5903CISM/NOPB Datasheet
Download the complete datasheet for Texas Instruments CLC5903CISM/NOPB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.