
N-channel NexFET™ MOSFET, single element configuration, features 25V drain-to-source breakdown voltage and 60A continuous drain current. Surface mountable in a 3x3mm SON package with tin, matte contact plating, this component offers a low 8.2mΩ Rds On (Max). Operating temperature range is -55°C to 150°C, with a maximum power dissipation of 2.6W. Key switching characteristics include a 6.5ns turn-on delay and 3.4ns fall time.
Texas Instruments CSD16409Q3 technical specifications.
| Package/Case | SON |
| Contact Plating | Tin, Matte |
| Continuous Drain Current (ID) | 60A |
| Drain to Source Breakdown Voltage | 25V |
| Drain to Source Voltage (Vdss) | 25V |
| Dual Supply Voltage | 25V |
| Element Configuration | Single |
| Fall Time | 3.4ns |
| Gate to Source Voltage (Vgs) | 16V |
| Height | 1.1mm |
| Input Capacitance | 800pF |
| Lead Free | Contains Lead |
| Length | 3.4mm |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| Max Power Dissipation | 2.6W |
| Mount | Surface Mount |
| Nominal Vgs | 2V |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Polarity | N-CHANNEL |
| Power Dissipation | 2.6W |
| Radiation Hardening | No |
| Rds On Max | 8.2mR |
| Reach SVHC Compliant | No |
| RoHS Compliant | Yes |
| Series | NexFET™ |
| Termination | SMD/SMT |
| Threshold Voltage | 2V |
| Turn-Off Delay Time | 6.3ns |
| Turn-On Delay Time | 6.5ns |
| Width | 3.4mm |
| RoHS | Compliant |
Download the complete datasheet for Texas Instruments CSD16409Q3 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.