Positive-edge triggered D-type bus interface flip-flop, featuring a single 8-bit element with non-inverting outputs. This CMOS logic IC is housed in a 20-pin Ceramic Dual In-Line Package (CDIP) with through-hole mounting. Operating across a temperature range of -55°C to 125°C, the component offers robust performance in a ceramic package.
PackageCDIP
MountingThrough Hole
PolarityNon-Inverting
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Technical Specifications
Texas Instruments CY54FCT273TDMB technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
CDIP
Package Description
Ceramic Dual In Line Package
Lead Shape
Through Hole
Pin Count
20
PCB
20
Package Length (mm)
24.64(Max)
Package Width (mm)
7.87(Max)
Package Height (mm)
3.56(Max)
Seated Plane Height (mm)
5.08(Max)
Pin Pitch (mm)
2.79(Max)
Package Material
Ceramic
Mounting
Through Hole
Logic Family
FCT
Logic Function
D-Type Bus Interface
Process Technology
CMOS
Number of Elements per Chip
1
Number of Element Inputs
8
Number of Element Outputs
8
Polarity
Non-Inverting
Triggering Type
Positive-Edge
Min Operating Temperature
-55°C
Max Operating Temperature
125°C
Compliance
Cage Code
01295
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Texas Instruments CY54FCT273TDMB Datasheet
Download the complete datasheet for Texas Instruments CY54FCT273TDMB to view detailed technical specifications.
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