Positive-edge triggered, non-inverting D-type bus interface flip-flop featuring 8 elements per chip, each with 8 inputs and 8 3-state outputs. This CMOS logic IC is housed in a 20-pin SSOP (Shrink Small Outline Package) with gull-wing leads for surface mounting. The package dimensions are a maximum of 8.75mm length, 4mm width, and 1.5mm height, with a 0.64mm pin pitch. Operating temperature range is 0°C to 70°C.
PackageSSOP
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Texas Instruments CY74FCT374DTQC technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
8.75(Max)
Package Width (mm)
4(Max)
Package Height (mm)
1.5(Max)
Seated Plane Height (mm)
1.75(Max)
Pin Pitch (mm)
0.64
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-137AD
Logic Family
FCT
Logic Function
D-Type Bus Interface
Process Technology
CMOS
Number of Elements per Chip
1
Number of Element Inputs
8
Number of Element Outputs
8
Output Type
3-State
Polarity
Non-Inverting
Triggering Type
Positive-Edge
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
01295
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Texas Instruments CY74FCT374DTQC Datasheet
Download the complete datasheet for Texas Instruments CY74FCT374DTQC to view detailed technical specifications.
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