Frequency216MHz
PackageLFBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments DM355SDZCE216 technical specifications.
General
Package/Case
LFBGA
Core Architecture
RISC
Frequency
216MHz
Interface
I2C, SPI, USB, UART
Lead Free
Contains Lead
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Mount
Surface Mount
Package Quantity
160
Packaging
Tray
RAM Size
32768B
RoHS Compliant
Yes
Series
TMS320DM3x, DaVinci™
Compliance
RoHS
Compliant
Datasheet
Texas Instruments DM355SDZCE216 Datasheet
Download the complete datasheet for Texas Instruments DM355SDZCE216 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.