Frequency270MHz
PackageLFBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments DM355SDZCE270 technical specifications.
General
| Package/Case | LFBGA |
| Core Architecture | RISC |
| Frequency | 270MHz |
| Interface | I2C, SPI, USB, UART |
| Lead Free | Contains Lead |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Max Supply Voltage | 1.365V |
| Min Supply Voltage | 1.235V |
| Mount | Surface Mount |
| Operating Supply Voltage | 1.3V |
| Package Quantity | 160 |
| Packaging | Tray |
| Radiation Hardening | No |
| RAM Size | 32768B |
| RoHS Compliant | Yes |
| Series | TMS320DM3x, DaVinci™ |
Compliance
| RoHS | Compliant |
Datasheet
Texas Instruments DM355SDZCE270 Datasheet
Download the complete datasheet for Texas Instruments DM355SDZCE270 to view detailed technical specifications.
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