Frequency270MHz
PackageLFBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments DM355SDZCE270 technical specifications.
General
Package/Case
LFBGA
Core Architecture
RISC
Frequency
270MHz
Interface
I2C, SPI, USB, UART
Lead Free
Contains Lead
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Max Supply Voltage
1.365V
Min Supply Voltage
1.235V
Mount
Surface Mount
Operating Supply Voltage
1.3V
Package Quantity
160
Packaging
Tray
Radiation Hardening
No
RAM Size
32768B
RoHS Compliant
Yes
Series
TMS320DM3x, DaVinci™
Compliance
RoHS
Compliant
Datasheet
Texas Instruments DM355SDZCE270 Datasheet
Download the complete datasheet for Texas Instruments DM355SDZCE270 to view detailed technical specifications.
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