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Technical Specifications
Texas Instruments INA129SHKJ technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | FPAK |
| Package/Case | CFPAK |
| Package Description | Ceramic Flat Package |
| Lead Shape | Flat |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 7.34(Max) |
| Package Width (mm) | 5.89(Max) |
| Package Height (mm) | 1.98(Max) |
| Seated Plane Height (mm) | 2.21(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Ceramic |
| Mounting | Surface Mount |
| Number of Channels per Chip | 1 |
| Maximum Input Offset Voltage | 0.125mV |
| Maximum Input Bias Current | 0.05(Typ)@210CuA |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 210°C |
| Minimum Dual Supply Voltage | ±2.25V |
| Maximum Dual Supply Voltage | ±18V |
Compliance
| Cage Code | 01295 |
| EU RoHS | No |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments INA129SHKJ Datasheet
Download the complete datasheet for Texas Instruments INA129SHKJ to view detailed technical specifications.
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