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Technical Specifications
Texas Instruments INA129SHKJ technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
FPAK
Package/Case
CFPAK
Package Description
Ceramic Flat Package
Lead Shape
Flat
Pin Count
8
PCB
8
Package Length (mm)
7.34(Max)
Package Width (mm)
5.89(Max)
Package Height (mm)
1.98(Max)
Seated Plane Height (mm)
2.21(Max)
Pin Pitch (mm)
1.27
Package Material
Ceramic
Mounting
Surface Mount
Number of Channels per Chip
1
Maximum Input Offset Voltage
0.125mV
Maximum Input Bias Current
0.05(Typ)@210CuA
Min Operating Temperature
-55°C
Max Operating Temperature
210°C
Minimum Dual Supply Voltage
±2.25V
Maximum Dual Supply Voltage
±18V
Compliance
Cage Code
01295
EU RoHS
No
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments INA129SHKJ Datasheet
Download the complete datasheet for Texas Instruments INA129SHKJ to view detailed technical specifications.
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