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Technical Specifications
Texas Instruments INA129SJD technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
SBCDIP
Package Description
Side Brazed Ceramic Dual In Line Package
Lead Shape
Through Hole
Pin Count
8
PCB
8
Package Length (mm)
13.97(Max)
Package Width (mm)
7.87(Max)
Package Height (mm)
3.05(Max)
Seated Plane Height (mm)
4.45(Max)
Pin Pitch (mm)
2.54
Mounting
Through Hole
Number of Channels per Chip
1
Maximum Input Offset Voltage
0.125mV
Maximum Input Bias Current
0.05(Typ)@210CuA
Min Operating Temperature
-55°C
Max Operating Temperature
210°C
Minimum Dual Supply Voltage
±2.25V
Maximum Dual Supply Voltage
±18V
Compliance
Cage Code
01295
EU RoHS
No
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments INA129SJD Datasheet
Download the complete datasheet for Texas Instruments INA129SJD to view detailed technical specifications.
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