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Technical Specifications
Texas Instruments INA129SJD technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | SBCDIP |
| Package Description | Side Brazed Ceramic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 13.97(Max) |
| Package Width (mm) | 7.87(Max) |
| Package Height (mm) | 3.05(Max) |
| Seated Plane Height (mm) | 4.45(Max) |
| Pin Pitch (mm) | 2.54 |
| Mounting | Through Hole |
| Number of Channels per Chip | 1 |
| Maximum Input Offset Voltage | 0.125mV |
| Maximum Input Bias Current | 0.05(Typ)@210CuA |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 210°C |
| Minimum Dual Supply Voltage | ±2.25V |
| Maximum Dual Supply Voltage | ±18V |
Compliance
| Cage Code | 01295 |
| EU RoHS | No |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments INA129SJD Datasheet
Download the complete datasheet for Texas Instruments INA129SJD to view detailed technical specifications.
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