32-bit ARM Cortex M3 RISC microcontroller featuring an 80 MHz clock rate and 64KB Flash program memory. This surface-mount device offers 16KB RAM, 44 programmable I/Os, and 6 timers. Connectivity includes I2C, SSI, and UART interfaces. The 108-pin NFBGA package, measuring 10x10x1.02mm with a 0.8mm pin pitch, operates from 2.75V to 3.6V and functions within a -40°C to 85°C temperature range. Includes a single ADC with 2 channels.
PackageNFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Texas Instruments LM3S1133-IBZ80-A2T technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
NFBGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
108
PCB
108
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
1.02
Seated Plane Height (mm)
1.36
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-219
Family Name
Stellaris
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
80MHz
Maximum CPU Frequency
80MHz
Device Core
ARM Cortex M3
Program Memory Type
Flash
Program Memory Size
64KB
RAM Size
16KB
Number of Programmable I/Os
44
Core Architecture
ARM
Programmability
Yes
Number of Timers
6
Interface Type
I2C/SSI/UART
CAN
0
I2C
1
SPI
0
Ethernet
0
UART
3
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
2.75|3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
ADC Channels
2
Number of ADCs
Single
Compliance
Cage Code
01295
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Texas Instruments LM3S1133-IBZ80-A2T Datasheet
Download the complete datasheet for Texas Instruments LM3S1133-IBZ80-A2T to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.