LM3S1J11-IBZ20-C0

32-bit ARM Cortex M3 MCU, 20MHz, 128KB Flash, 108-Pin NFBGA

32-bit ARM Cortex M3 RISC microcontroller featuring 128KB Flash program memory and 20KB RAM. This surface-mount device operates at up to 20 MHz and offers 67 programmable I/Os. Connectivity includes 2 I2C and 3 UART interfaces. The NFBGA package measures 10x10x1.02mm with a 0.8mm pin pitch, supporting a 1.2V/3.3V operating voltage range and an industrial temperature range of -40°C to 85°C.

PackageNFBGA

MountingSurface Mount

Quick Jump:

Technical Specifications

Texas Instruments LM3S1J11-IBZ20-C0 technical specifications.

General

Basic Package Type	Ball Grid Array
Package Family Name	BGA
Package/Case	NFBGA
Package Description	Plastic Ball Grid Array
Lead Shape	Ball
Pin Count	108
PCB	108
Package Length (mm)	10
Package Width (mm)	10
Package Height (mm)	1.02
Seated Plane Height (mm)	1.36
Pin Pitch (mm)	0.8
Package Material	Plastic
Mounting	Surface Mount
Jedec	MO-219
Family Name	Stellaris
Data Bus Width	32bit
Instruction Set Architecture	RISC
Maximum Clock Rate	20MHz
Maximum CPU Frequency	20MHz
Device Core	ARM Cortex M3
Program Memory Type	Flash
Program Memory Size	128KB
RAM Size	20KB
Number of Programmable I/Os	67
Core Architecture	ARM
Programmability	Yes
Number of Timers	3
Interface Type	I2C/SSI/UART
CAN	0
I2C	2
SPI	0
Ethernet	0
UART	3
USART	0
USB	0
I2S	0
Max Operating Supply Voltage	1.32\|3.6V
Min Operating Temperature	-40°C
Max Operating Temperature	85°C
ADC Channels	8
Number of ADCs	Single

Compliance

Cage Code	01295
HTS Code	8542310001
Schedule B	8542310000
Automotive	No
AEC Qualified	No
PPAP	No
Radiation Hardening	No
RoHS Versions	2011/65/EU

Datasheet

This datasheet cannot be embedded due to technical restrictions.

View Datasheet Download PDF