32-bit ARM Cortex M3 RISC microcontroller featuring an 80 MHz maximum clock rate. This integrated circuit offers 256KB of Flash program memory and 64KB of RAM. It supports I2C, SPI, SSI, and UART interfaces, with 36 programmable I/Os and 4 ADC channels from a single ADC. The device operates from 2.75V to 3.6V and is housed in a 108-pin NFBGA surface-mount package with a 0.8mm pin pitch.
PackageNFBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments LM3S8933-IBZ80 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | NFBGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 108 |
| PCB | 108 |
| Package Length (mm) | 10 |
| Package Width (mm) | 10 |
| Package Height (mm) | 1.02 |
| Seated Plane Height (mm) | 1.36 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-219 |
| Family Name | Stellaris |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Maximum Clock Rate | 80MHz |
| Maximum CPU Frequency | 80MHz |
| Device Core | ARM Cortex M3 |
| Program Memory Type | Flash |
| Program Memory Size | 256KB |
| RAM Size | 64KB |
| Number of Programmable I/Os | 36 |
| Core Architecture | ARM |
| Programmability | Yes |
| Number of Timers | 6 |
| Interface Type | I2C/SPI/SSI/UART |
| Max Operating Supply Voltage | 2.75|3.6V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| ADC Channels | 4 |
| Number of ADCs | Single |
Compliance
| Cage Code | 01295 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Texas Instruments LM3S8933-IBZ80 Datasheet
Download the complete datasheet for Texas Instruments LM3S8933-IBZ80 to view detailed technical specifications.
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