PackageHTSSOP EP
MountingSurface Mount
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Technical Specifications
Texas Instruments LM5117QPMH technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | HTSSOP EP |
| Package Description | Heat Sinked Thin Shrink Small Outline Package, Exposed Pad |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 6.6(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153ACT |
Compliance
| Cage Code | 01295 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | Yes |
| AEC Qualified | Yes |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments LM5117QPMH Datasheet
Download the complete datasheet for Texas Instruments LM5117QPMH to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.