The LMH0356SQX-40/NOPB is a 40-pin QFN packaged IC with a very thin profile and exposed pad, suitable for surface mount applications. It has a maximum package length and width of 5.15mm and a maximum height of 0.75mm. The IC is made of plastic and has a pin pitch of 0.4mm. It is designed for non-lead frame surface mount technology and is compliant with the JEDEC MO-220WHEE-1 standard.
PackageWQFN EP
MountingSurface Mount
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Technical Specifications
Texas Instruments LMH0356SQX-40/NOPB technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | WQFN EP |
| Package Description | Very Very Thin Quad Flat No Lead Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 40 |
| PCB | 40 |
| Package Length (mm) | 5.15(Max) |
| Package Width (mm) | 5.15(Max) |
| Package Height (mm) | 0.75(Max) |
| Seated Plane Height (mm) | 0.8(Max) |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-220WHEE-1 |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments LMH0356SQX-40/NOPB Datasheet
Download the complete datasheet for Texas Instruments LMH0356SQX-40/NOPB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.