PackageWQFN EP
MountingSurface Mount
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Technical Specifications
Texas Instruments LMK04816BISQX technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | WQFN EP |
| Package Description | Very Very Thin Quad Flat No Lead Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 9.1(Max) |
| Package Width (mm) | 9.1(Max) |
| Package Height (mm) | 0.8(Max) |
| Seated Plane Height (mm) | 0.8(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-220 |
Compliance
| Cage Code | 01295 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments LMK04816BISQX Datasheet
Download the complete datasheet for Texas Instruments LMK04816BISQX to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.