PackageVSSOP
MountingSurface Mount
Quick Jump:
Technical Specifications
Texas Instruments LMP8481MME-F technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
VSSOP
Package Description
Very Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
3.1(Max)
Package Width (mm)
3.1(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Type
Current Sense Amplifier
Number of Elements per Chip
2
Number of Channels per Chip
1
Minimum PSRR
122(Typ)dB
Maximum Input Offset Voltage
0.265@48VmV
Maximum Input Bias Current
6.3(Typ)@76VuA
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
01295
HTS Code
8542330001
Schedule B
8542330000
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Texas Instruments LMP8481MME-F Datasheet
Download the complete datasheet for Texas Instruments LMP8481MME-F to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.