PackageWSON EP
MountingSurface Mount
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Technical Specifications
Texas Instruments LMP8481SDE-F technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | SON |
| Package/Case | WSON EP |
| Package Description | Very Very Thin Small Outline No Lead Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 3 |
| Package Width (mm) | 3 |
| Package Height (mm) | 0.8(Max) |
| Seated Plane Height (mm) | 0.8(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | Current Sense Amplifier |
| Number of Elements per Chip | 2 |
| Number of Channels per Chip | 1 |
| Minimum PSRR | 122(Typ)dB |
| Maximum Input Offset Voltage | 0.265@48VmV |
| Maximum Input Bias Current | 6.3(Typ)@76VuA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
Compliance
| Cage Code | 01295 |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Texas Instruments LMP8481SDE-F Datasheet
Download the complete datasheet for Texas Instruments LMP8481SDE-F to view detailed technical specifications.
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