PackageWSON EP
MountingSurface Mount
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Technical Specifications
Texas Instruments LMP8481SDE-S technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
SON
Package/Case
WSON EP
Package Description
Very Very Thin Small Outline No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
8
PCB
8
Package Length (mm)
3
Package Width (mm)
3
Package Height (mm)
0.8(Max)
Seated Plane Height (mm)
0.8(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Type
Current Sense Amplifier
Number of Elements per Chip
2
Number of Channels per Chip
1
Minimum PSRR
122(Typ)dB
Maximum Input Offset Voltage
0.265@48VmV
Maximum Input Bias Current
6.3(Typ)@76VuA
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
01295
HTS Code
8542330001
Schedule B
8542330000
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Texas Instruments LMP8481SDE-S Datasheet
Download the complete datasheet for Texas Instruments LMP8481SDE-S to view detailed technical specifications.
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