PackageTSSOP
MountingSurface Mount
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Technical Specifications
Texas Instruments LMP91200MTX technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
5.1(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AB
Compliance
Cage Code
01295
EU RoHS
No
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments LMP91200MTX Datasheet
Download the complete datasheet for Texas Instruments LMP91200MTX to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.