PackageDSBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments LMV226UR/NOPB technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | DSBGA |
| Package Description | Die Size Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 4 |
| PCB | 4 |
| Package Length (mm) | 1 |
| Package Width (mm) | 1 |
| Package Height (mm) | 0.24(Max) |
| Seated Plane Height (mm) | 0.35 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Frequency Band | 450 to 2000MHz |
| Maximum Input Power | 15dBm |
| Min Operating Supply Voltage | 2.7V |
| Max Operating Supply Voltage | 5.5V |
| Typical Supply Current | 5.3mA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Typical Output Current | 5.3mA |
| Maximum Output Voltage | 2V |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments LMV226UR/NOPB Datasheet
Download the complete datasheet for Texas Instruments LMV226UR/NOPB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.