PackageDSBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments LP8501TME/NOPB technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
DSBGA
Package Description
Die Size Ball Grid Array
Lead Shape
Ball
Pin Count
25
PCB
25
Package Length (mm)
2.29(Max)
Package Width (mm)
2.29(Max)
Package Height (mm)
0.47(Max)
Seated Plane Height (mm)
0.6
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Number of Segments
9
Output Voltage
-0.3 to 6V
Min Operating Temperature
-30°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
5.5V
Min Operating Supply Voltage
2.7V
Typical Operating Supply Voltage
3.3|5V
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments LP8501TME/NOPB Datasheet
Download the complete datasheet for Texas Instruments LP8501TME/NOPB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.