PackageDSBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments LP8501TMX/NOPB technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | DSBGA |
| Package Description | Die Size Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 25 |
| PCB | 25 |
| Package Length (mm) | 2.29(Max) |
| Package Width (mm) | 2.29(Max) |
| Package Height (mm) | 0.47(Max) |
| Seated Plane Height (mm) | 0.6 |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Number of Segments | 9 |
| Output Voltage | -0.3 to 6V |
| Min Operating Temperature | -30°C |
| Max Operating Temperature | 85°C |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Supply Voltage | 2.7V |
| Typical Operating Supply Voltage | 3.3|5V |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments LP8501TMX/NOPB Datasheet
Download the complete datasheet for Texas Instruments LP8501TMX/NOPB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.