Texas Instruments
LP8725TLE
POWER MANAGEMENT UNIT FOR APPLICATION/MULTIMEDIA PROCESSORS AND SUB-SYSTEMS
PackageDSBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments LP8725TLE technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
DSBGA
Package Description
Die Size Ball Grid Array
Lead Shape
Ball
Pin Count
30
PCB
30
Package Length (mm)
3.01(Max)
Package Width (mm)
2.61(Max)
Package Height (mm)
0.41(Max)
Seated Plane Height (mm)
0.6
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
01295
EU RoHS
No
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments LP8725TLE Datasheet
Download the complete datasheet for Texas Instruments LP8725TLE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.