Texas Instruments
LP8725TLX
POWER MANAGEMENT UNIT FOR APPLICATION/MULTIMEDIA PROCESSORS AND SUB-SYSTEMS
PackageDSBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments LP8725TLX technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | DSBGA |
| Package Description | Die Size Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 30 |
| PCB | 30 |
| Package Length (mm) | 3.01(Max) |
| Package Width (mm) | 2.61(Max) |
| Package Height (mm) | 0.41(Max) |
| Seated Plane Height (mm) | 0.6 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 01295 |
| EU RoHS | No |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments LP8725TLX Datasheet
Download the complete datasheet for Texas Instruments LP8725TLX to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.