PackageFCBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments OMAP3503DCUSA technical specifications.
General
Package/Case
FCBGA
Core Architecture
ARM
Data Bus Width
32b
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Type
ROM, L2 Cache
Min Operating Temperature
-40°C
Max Supply Voltage
1.89V
Min Supply Voltage
1.71V
Mount
Surface Mount
Number of Cores
1
Number of UART Channels
3
Package Quantity
1
Packaging
Tray
Radiation Hardening
No
RAM Size
65536B
RoHS Compliant
Yes
Series
OMAP-35xx
Compliance
RoHS
Compliant
Datasheet
Texas Instruments OMAP3503DCUSA Datasheet
Download the complete datasheet for Texas Instruments OMAP3503DCUSA to view detailed technical specifications.
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