PackageVQFN EP
MountingSurface Mount
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Technical Specifications
Texas Instruments PGA870IRHDT technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
VQFN EP
Package Description
Very Thin Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
28
PCB
28
Package Length (mm)
5.15(Max)
Package Width (mm)
5.15(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Type
Differential Amplifier
Number of Elements per Chip
1
Number of Channels per Chip
1
Minimum PSRR
54dB
Maximum Input Bias Current
0.5(Typ)@5V@-40C to 85CuA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments PGA870IRHDT Datasheet
Download the complete datasheet for Texas Instruments PGA870IRHDT to view detailed technical specifications.
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