16-channel non-inverting 3-state buffer/line driver utilizing BiCMOS process technology. This integrated circuit features 16 inputs and 16 outputs, with 2 elements per chip. Housed in a 48-pin Thin Shrink Small Outline Package (TSSOP) with gull-wing leads, it supports surface mounting and operates within a temperature range of -40°C to 85°C.
PackageTSSOP
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Texas Instruments SN74ABT16541DGGR technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 12.6(Max) |
| Package Width (mm) | 6.2(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153ED |
| Logic Family | ABT |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 2 |
| Number of Inputs per Chip | 16 |
| Number of Outputs per Chip | 16 |
| Process Technology | BiCMOS |
| Polarity | Non-Inverting |
| Output Type | 3-State |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 01295 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Texas Instruments SN74ABT16541DGGR Datasheet
Download the complete datasheet for Texas Instruments SN74ABT16541DGGR to view detailed technical specifications.
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