PackageX2SON
MountingSurface Mount
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Technical Specifications
Texas Instruments SN74AUP1G00DSFR technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | SON |
| Package/Case | X2SON |
| Lead Shape | No Lead |
| Pin Count | 6 |
| PCB | 6 |
| Package Length (mm) | 1.05(Max) |
| Package Width (mm) | 1.05(Max) |
| Package Height (mm) | 0.35(Max) |
| Seated Plane Height (mm) | 0.4(Max) |
| Pin Pitch (mm) | 0.35 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-287X2AAF |
| Logic Family | AUP |
| Logic Function | NAND |
| Process Technology | CMOS |
| Number of Elements per Chip | 1 |
| Number of Element Inputs | 2-IN |
| Number of Element Outputs | 1 |
| Output Type | Push-Pull |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments SN74AUP1G00DSFR Datasheet
Download the complete datasheet for Texas Instruments SN74AUP1G00DSFR to view detailed technical specifications.
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