3-channel non-inverting buffer with push-pull CMOS output. This surface-mount integrated circuit features 3 elements, each with one input and one output, utilizing the AUP logic family. Housed in an 8-pin Die Size Ball Grid Array (DSBGA) package measuring 1.6mm x 0.8mm x 0.33mm, it operates across a temperature range of -40°C to 85°C and supports 3.6V tolerant I/Os.
PackageDSBGA
MountingSurface Mount
PolarityNon-Inverting
Quick Jump:
Technical Specifications
Texas Instruments SN74AUP3G34YFPR technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | DSBGA |
| Package Description | Die Size Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 1.6 |
| Package Width (mm) | 0.8 |
| Package Height (mm) | 0.33(Max) |
| Seated Plane Height (mm) | 0.5(Max) |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Logic Family | AUP |
| Logic Function | Buffer |
| Number of Elements per Chip | 3 |
| Number of Inputs per Chip | 3 |
| Number of Outputs per Chip | 3 |
| Process Technology | CMOS |
| Polarity | Non-Inverting |
| Output Type | Push-Pull |
| Tolerant I/Os | 3.6V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments SN74AUP3G34YFPR Datasheet
Download the complete datasheet for Texas Instruments SN74AUP3G34YFPR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.