CMOS 2-input AND gate IC featuring four independent elements. This 14-pin SSOP (Shrink Small Outline Package) is designed for surface mounting with a 0.65mm pin pitch and gull-wing lead shape. Operating within a temperature range of -40°C to 85°C, it utilizes push-pull output type and is housed in a plastic package conforming to JEDEC MO-150AB.
PackageSSOP
MountingSurface Mount
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Technical Specifications
Texas Instruments SN74LVC08DBLE technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SSOP |
| Package Description | Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 6.5(Max) |
| Package Width (mm) | 5.6(Max) |
| Package Height (mm) | 2(Max) - 0.05(Min) |
| Seated Plane Height (mm) | 2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-150AB |
| Logic Family | LVC |
| Logic Function | AND |
| Process Technology | CMOS |
| Number of Elements per Chip | 4 |
| Number of Element Inputs | 2-IN |
| Number of Element Outputs | 1 |
| Output Type | Push-Pull |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 01295 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Texas Instruments SN74LVC08DBLE Datasheet
Download the complete datasheet for Texas Instruments SN74LVC08DBLE to view detailed technical specifications.
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