16-bit RISC microcontroller featuring 4KB Flash program memory. This surface-mount device utilizes a Thin Shrink Small Outline Package (TSSOP) with 20 gull-wing leads on a 0.65mm pitch. Operating at a maximum CPU frequency of 8 MHz, it supports multiple voltage levels including 1.8V, 2.5V, and 3.3V. The component is designed for lead-frame SMT mounting and operates within a temperature range of -40°C to 85°C.
PackageTSSOP
MountingSurface Mount
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Technical Specifications
Texas Instruments SP430F1122IPWR technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
6.6(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AC
Family Name
MSP430
Data Bus Width
16bit
Instruction Set Architecture
RISC
Maximum CPU Frequency
8MHz
Device Core
MSP430
Program Memory Type
Flash
Program Memory Size
4KB
Core Architecture
MSP430
Programmability
Yes
CAN
0
I2C
0
SPI
0
Ethernet
0
UART
0
USART
0
USB
0
I2S
0
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
01295
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Texas Instruments SP430F1122IPWR Datasheet
Download the complete datasheet for Texas Instruments SP430F1122IPWR to view detailed technical specifications.
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