32-bit fixed-point digital signal processor (DSP) operating at 600 MHz, delivering 4800 MIPS. Features a 376-pin Ball Grid Array (BGA) package with a 1mm pin pitch, designed for surface mounting. Includes 96KB of RAM and supports interfaces such as Ethernet, I2C, I2S, SPI, and UART. This ROMLess device is part of the C6000 family and operates within a temperature range of 0°C to 90°C.
PackageBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TMS320C6421ZDU6 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Ball Grid Array
Lead Shape
Ball
Pin Count
376
PCB
376
Package Length (mm)
23.2(Max)
Package Width (mm)
23.2(Max)
Package Height (mm)
1.88(Max)
Seated Plane Height (mm)
2.48(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Family Name
C6000
Data Bus Width
32bit
Instruction Set Architecture
Advanced VLIW
Numeric and Arithmetic Format
Fixed-Point
Device Core
C64x
Program Memory Type
ROMLess
RAM Size
96KB
Maximum Speed
600MHz
Number of Programmable I/Os
111
Device Million Instructions per Second
4800MIPS
Device Input Clock Speed
600MHz
Typical Operating Supply Voltage
1.05|1.2|1.8|3.3V
Min Operating Temperature
0°C
Max Operating Temperature
90°C
Interface Type
Ethernet/I2C/I2S/SPI/UART
I2C
1
CAN
0
UART
1
Ethernet
1
USART
0
USB
0
SPI
1
I2S
1
Programmability
No
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TMS320C6421ZDU6 Datasheet
Download the complete datasheet for Texas Instruments TMS320C6421ZDU6 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.