High-performance 32-bit fixed-point Digital Signal Processor (DSP) operating at 720 MHz, delivering 8000 MIPS. Features an Advanced VLIW instruction set architecture and a C64x device core. This ROMLess DSP is housed in a 697-pin Flip Chip Ball Grid Array (FCBGA) package with a 0.8mm pin pitch, designed for surface mounting. Includes Ethernet and I2C interface support, with a wide operating temperature range of 0°C to 90°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TMS320C6454BCTZ7 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
697
PCB
697
Package Length (mm)
24.1(Max)
Package Width (mm)
24.1(Max)
Package Height (mm)
2.74(Max)
Seated Plane Height (mm)
3.24(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
C6000
Data Bus Width
32bit
Instruction Set Architecture
Advanced VLIW
Numeric and Arithmetic Format
Fixed-Point
Device Core
C64x
Program Memory Type
ROMLess
Maximum Speed
720MHz
Number of Programmable I/Os
16
Device Million Instructions per Second
8000MIPS
Device Input Clock Speed
720MHz
Typical Operating Supply Voltage
1.2|1.5|1.8|3.3V
Min Operating Temperature
0°C
Max Operating Temperature
90°C
Interface Type
Ethernet/I2C
I2C
1
CAN
0
UART
0
Ethernet
1
USART
0
USB
0
SPI
0
I2S
0
Programmability
No
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TMS320C6454BCTZ7 Datasheet
Download the complete datasheet for Texas Instruments TMS320C6454BCTZ7 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.