High-performance Digital Signal Processor (DSP) featuring a 32-bit fixed-point architecture and a VLIW instruction set. Achieves a maximum speed of 1.2GHz, delivering 9600 MIPS for demanding applications. This surface-mount device is housed in a 688-pin FCBGA package with a 0.8mm pin pitch. Integrated interfaces include Ethernet and I2C, with 16 programmable I/Os for flexible system integration. Operates across a typical supply voltage range of 1.1V to 3.3V and a temperature range of 0°C to 95°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TMS320C6457CCMH2 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
688
PCB
688
Package Length (mm)
23.1(Max)
Package Width (mm)
23.1(Max)
Package Height (mm)
2.85(Max)
Seated Plane Height (mm)
3.3(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-012AA
Family Name
C6000
Data Bus Width
32bit
Instruction Set Architecture
VLIW
Numeric and Arithmetic Format
Fixed-Point
Program Memory Type
ROM
Program Memory Size
64KB
Maximum Speed
1200MHz
Number of Programmable I/Os
16
Device Million Instructions per Second
9600MIPS
Device Input Clock Speed
1200MHz
Typical Operating Supply Voltage
1.1|1.2|1.8|3.3V
Min Operating Temperature
0°C
Max Operating Temperature
95°C
Interface Type
Ethernet/I2C
I2C
1
CAN
0
UART
0
Ethernet
1
USART
0
USB
0
SPI
0
I2S
0
Programmability
Yes
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TMS320C6457CCMH2 Datasheet
Download the complete datasheet for Texas Instruments TMS320C6457CCMH2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.