32-bit VLIW Digital Signal Processor (DSP) operating at 300 MHz, delivering 2400 MIPS. Features fixed-point and floating-point arithmetic, 576KB RAM, and a ROMLess program memory type. Surface-mount Ball Grid Array (BGA) package with 256 pins, measuring 17.2mm x 17.2mm x 1.45mm. Includes Ethernet, I2C, SPI, UART, and USB interfaces.
PackageBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TMS320C6747AZKB3 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17.2(Max)
Package Width (mm)
17.2(Max)
Package Height (mm)
1.45(Max)
Package Material
Plastic
Mounting
Surface Mount
Family Name
C6000
Data Bus Width
32bit
Instruction Set Architecture
VLIW
Numeric and Arithmetic Format
Fixed-Point|Floating-Point
Device Core
C674x
Program Memory Type
ROMLess
RAM Size
576KB
Maximum Speed
300MHz
Number of Programmable I/Os
16
Device Million Instructions per Second
2400MIPS
Device Input Clock Speed
300MHz
Typical Operating Supply Voltage
1.2V
Min Operating Temperature
0°C
Max Operating Temperature
90°C
Interface Type
Ethernet/I2C/SPI/UART/USB
I2C
2
CAN
0
UART
3
Ethernet
1
USART
0
USB
1
SPI
2
I2S
0
Programmability
No
Compliance
Cage Code
01295
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Texas Instruments TMS320C6747AZKB3 Datasheet
Download the complete datasheet for Texas Instruments TMS320C6747AZKB3 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.