PackageNFBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TMS320DM335CZCE135 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
NFBGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
337
PCB
337
Package Length (mm)
13
Package Width (mm)
13
Package Height (mm)
0.89
Seated Plane Height (mm)
1.3(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TMS320DM335CZCE135 Datasheet
Download the complete datasheet for Texas Instruments TMS320DM335CZCE135 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.