The TMS320DM335CZCE135 is a 337-pin Ball Grid Array digital signal processor from Texas Instruments. It features a plastic package with a seated plane height of 1.3mm and a pin pitch of 0.65mm. The processor is designed for surface mount applications and has a package length, width, and height of 13mm, 13mm, and 0.89mm, respectively. The device is suitable for use in a variety of applications, including those with high pin counts and complex digital signal processing requirements.
PackageNFBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TMS320DM335CZCE135 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | NFBGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 337 |
| PCB | 337 |
| Package Length (mm) | 13 |
| Package Width (mm) | 13 |
| Package Height (mm) | 0.89 |
| Seated Plane Height (mm) | 1.3(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments TMS320DM335CZCE135 Datasheet
Download the complete datasheet for Texas Instruments TMS320DM335CZCE135 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.