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Technical Specifications
Texas Instruments TMS320DM8147BCYE2 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
684
PCB
684
Package Length (mm)
23.1(Max)
Package Width (mm)
23.1(Max)
Package Height (mm)
2.5
Seated Plane Height (mm)
3.06(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A002.a.1.a
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TMS320DM8147BCYE2 Datasheet
Download the complete datasheet for Texas Instruments TMS320DM8147BCYE2 to view detailed technical specifications.
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