High-performance 32-bit fixed-point digital signal processor (DSP) operating at 700 MHz, delivering 5600 MIPS. Features 768KB ROM program memory and a 737-pin Flip Chip Ball Grid Array (FCBGA) package for surface mounting. This DSP supports multiple operating voltages (1.2V, 1.5V, 1.8V, 3.3V) and operates within a temperature range of 0°C to 85°C. The 24mm x 24mm package has a 0.8mm pin pitch and a maximum seated plane height of 3.5mm.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TMX320C6472CZTZ7 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
737
PCB
737
Package Length (mm)
24
Package Width (mm)
24
Package Height (mm)
2.65
Seated Plane Height (mm)
3.5(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Data Bus Width
32bit
Numeric and Arithmetic Format
Fixed-Point
Program Memory Type
ROM
Program Memory Size
768KB
Maximum Speed
700MHz
Device Million Instructions per Second
5600MIPS
Device Input Clock Speed
700MHz
Typical Operating Supply Voltage
1.2|1.5|1.8|3.3V
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Programmability
No
Compliance
Cage Code
01295
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Texas Instruments TMX320C6472CZTZ7 Datasheet
Download the complete datasheet for Texas Instruments TMX320C6472CZTZ7 to view detailed technical specifications.
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