High-performance 32-bit fixed-point digital signal processor (DSP) operating at 700 MHz, delivering 5600 MIPS. Features 768KB ROM program memory and a 737-pin Flip Chip Ball Grid Array (FCBGA) package for surface mounting. This DSP supports multiple operating voltages (1.2V, 1.5V, 1.8V, 3.3V) and operates within a temperature range of 0°C to 85°C. The 24mm x 24mm package has a 0.8mm pin pitch and a maximum seated plane height of 3.5mm.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TMX320C6472CZTZ7 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 737 |
| PCB | 737 |
| Package Length (mm) | 24 |
| Package Width (mm) | 24 |
| Package Height (mm) | 2.65 |
| Seated Plane Height (mm) | 3.5(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Data Bus Width | 32bit |
| Numeric and Arithmetic Format | Fixed-Point |
| Program Memory Type | ROM |
| Program Memory Size | 768KB |
| Maximum Speed | 700MHz |
| Device Million Instructions per Second | 5600MIPS |
| Device Input Clock Speed | 700MHz |
| Typical Operating Supply Voltage | 1.2|1.5|1.8|3.3V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Programmability | No |
Compliance
| Cage Code | 01295 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.2 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Texas Instruments TMX320C6472CZTZ7 Datasheet
Download the complete datasheet for Texas Instruments TMX320C6472CZTZ7 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.