PackageDSBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TPS659121YFFR technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
DSBGA
Package Description
Die Size Ball Grid Array
Lead Shape
Ball
Pin Count
81
PCB
81
Package Length (mm)
3.6
Package Width (mm)
3.6
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Function
Application Processors
Input Voltage
2.7 to 5.5V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TPS659121YFFR Datasheet
Download the complete datasheet for Texas Instruments TPS659121YFFR to view detailed technical specifications.
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