The TSC2301IGQZ is a specialized IC for SPI, I2S, and serial interface applications, operating within a temperature range of -40°C to 85°C. It is available in a VFBGA package, suitable for surface mount applications. The device is not RoHS compliant and contains lead, and its weight is approximately 0.002815 oz. The IC supports 12-bit resolution and is not radiation hardened.
PackageVFBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TSC2301IGQZ technical specifications.
General
| Package/Case | VFBGA |
| Interface | SPI, Serial, I2S, 4-WIRE |
| Lead Free | Contains Lead |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 2.7V |
| Mount | Surface Mount |
| Number of Bits | 12 |
| Package Quantity | 1 |
| Packaging | Tray |
| Radiation Hardening | No |
| Resolution | 12b |
| RoHS Compliant | No |
| Weight | 0.002815oz |
Compliance
| RoHS | Not CompliantNo |
Datasheet
Texas Instruments TSC2301IGQZ Datasheet
Download the complete datasheet for Texas Instruments TSC2301IGQZ to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.