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Technical Specifications
Texas Instruments TUSB1310IZAYR technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Ball Grid Array
Lead Shape
Ball
Pin Count
175
PCB
175
Package Length (mm)
12
Package Width (mm)
12
Package Height (mm)
0.9
Seated Plane Height (mm)
1.4(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Data Rate
5Gbps
Number of Transceivers
1
Protocols Supported
USB 3.0
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Typical Dual Supply Voltage
1.1|1.8|3.3V
Minimum Dual Supply Voltage
1.045|1.62|1.71|2.97V
Maximum Dual Supply Voltage
1.155|1.98|3.63V
Power Supply Type
Quint
Compliance
Cage Code
01295
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Texas Instruments TUSB1310IZAYR Datasheet
Download the complete datasheet for Texas Instruments TUSB1310IZAYR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.