
High-speed USB 3.0 transceiver supporting 5Gbps data rates. This integrated circuit features a single transceiver and is housed in a 175-pin, 12mm x 12mm x 0.9mm Ball Grid Array (BGA) package with 0.8mm pin pitch for surface mounting. It operates with quint power supply voltages ranging from 1.045V to 3.63V and functions within an ambient temperature range of 0°C to 70°C.
Texas Instruments TUSB1310ZAY technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 175 |
| PCB | 175 |
| Package Length (mm) | 12 |
| Package Width (mm) | 12 |
| Package Height (mm) | 0.9 |
| Seated Plane Height (mm) | 1.4(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Data Rate | 5Gbps |
| Number of Transceivers | 1 |
| Protocols Supported | USB 3.0 |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Typical Dual Supply Voltage | 1.1|1.8|3.3V |
| Minimum Dual Supply Voltage | 1.045|1.62|1.71|2.97V |
| Maximum Dual Supply Voltage | 1.155|1.98|3.63V |
| Power Supply Type | Quint |
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Texas Instruments TUSB1310ZAY to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.